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          Institute: MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung)     Collection: Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)     Display Documents



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ID: 112654.0, MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung) / Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
Authors:Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Language:English
Date of Publication (YYYY-MM-DD):2003-05-01
Title of Journal:Journal of Applied Physics
Journal Abbrev.:J. Appl. Phys.
Volume:93
Issue / Number:9
Start Page:5701
End Page:5706
Review Status:Peer-review
Audience:Experts Only
Comment of the Author/Creator:Date: 2003, MAY 1
External Publication Status:published
Document Type:Article
Communicated by:Holger Pfaff
Affiliations:MPI für Metallforschung/Abt. Arzt
External Affiliations:Oak Ridge Natl Lab, Div Met & Ceram, Oak Ridge, TN 37831 USA.; Adv Light Source, Berkeley, CA 94720 USA.; Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA.; Stanford Synchrotron Radiat Labs, Stanford, CA 94309 USA.
Identifiers:ISI:000182296700108 [ID No:1]
ISSN:0021-8979 [ID No:2]
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