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Home Search Quick Search Advanced Fulltext Browse Collections Persons My eDoc Session History Login Name: Password: Documentation Help Support Wiki Direct access to document ID:	Institute: MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung)     Collection: Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)     Display Documents   history ID: 112654.0, MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung) / Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems) Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R. Language: English Date of Publication (YYYY-MM-DD): 2003-05-01 Title of Journal: Journal of Applied Physics Journal Abbrev.: J. Appl. Phys. Volume: 93 Issue / Number: 9 Start Page: 5701 End Page: 5706 Review Status: Peer-review Audience: Experts Only Comment of the Author/Creator: Date: 2003, MAY 1 External Publication Status: published Document Type: Article Communicated by: Holger Pfaff Affiliations: MPI für Metallforschung/Abt. Arzt External Affiliations: Oak Ridge Natl Lab, Div Met & Ceram, Oak Ridge, TN 37831 USA.; Adv Light Source, Berkeley, CA 94720 USA.; Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA.; Stanford Synchrotron Radiat Labs, Stanford, CA 94309 USA. Identifiers: ISI:000182296700108 [ID No:1] ISSN:0021-8979 [ID No:2] The scope and number of records on eDoc is subject to the collection policies defined by each institute - see "info" button in the collection browse view.