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          Institute: MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung)     Collection: Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)     Display Documents



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ID: 174881.0, MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung) / Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)
Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect
Authors:Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Bravman, J. C.; Patel, J. R.
Language:English
Publisher:Materials Research Society
Date of Publication (YYYY-MM-DD):2004-06-20
Title of Proceedings:Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics
Start Page:F7.4.1
End Page:F7.4.10
Title of Series:Materials Research Society Symposium Proceedings
Volume (in Series):812
Name of Conference/Meeting:Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics. Symposium at the MRS Spring Meeting 2004
Place of Conference/Meeting:San Francisco
(Start) Date of Conference/Meeting
 (YYYY-MM-DD):
2004-04-12
End Date of Conference/Meeting 
 (YYYY-MM-DD):
2004-04-16
Copyright:Materials Research Society
Review Status:Peer-review
Audience:Experts Only
External Publication Status:published
Document Type:Conference-Paper
Communicated by:Holger Pfaff
Affiliations:MPI für Metallforschung/Abt. Arzt
External Affiliations:Metals & Ceramics Divisions, Oak Ridge National Laboratory, Oak Ridge TN 37831;
Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley CA 94720;
Dept. Materials Science & Engineering, Stanford University, Stanford CA 94305;
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