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          Institute: MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung)     Collection: Stuttgart Center for Electron Microscopy: StEM     Display Documents



ID: 319824.0, MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung) / Stuttgart Center for Electron Microscopy: StEM
Bonding at copper-alumina interfaces established by different surface treatments: a critical review
Authors:Scheu, C.; Gao, M.; Oh, S. H.; Dehm, G.; Klein, S.; Tomsia, A. P.; Rühle, M.
Language:English
Date of Publication (YYYY-MM-DD):2006
Title of Journal:Journal of Materials Science
Volume:41
Issue / Number:16
Start Page:5161
End Page:5168
Review Status:Peer-review
Audience:Experts Only
External Publication Status:published
Document Type:Article
Communicated by:Fritz Phillipp
Affiliations:MPI für Metallforschung/Emeriti and Others
MPI für Metallforschung/Stuttgart Center for Electron Microscopy (StEM)
External Affiliations:Department Metallkunde und Werkstoffprüfung. Montanuniversität Leoben, Franz-Josef-Str. 18, 8700 Leoben, Austria;
Department of Electrical and Computer Engineering, The Ohio State University, Columbus, Ohio 43210, USA;
Erich Schmid Institut für Materialwissenschaft, Österreichische Akademie der Wissenschaften, Jahnstr. 12, 8700 Leoben, Austria;
Department Materialphysik, Montanuniversität Leoben, Jahnstr. 12, 8700 Leoben, Austria
Identifiers:DOI:101007/s10853-006-0073-0
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