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          Institute: MPI für Plasmaphysik     Collection: Articles, Books, Inbooks     Display Documents



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ID: 436459.0, MPI für Plasmaphysik / Articles, Books, Inbooks
Micromechanical model of 3D cross-ply copper matrix composite reinforced with SiC fibres
Authors:Rios, A.; Martin-Meizoso, A.; You, J. H.; Martinez-Esnaola, J. M.; Gil Sevillano, J.; Fuentes, M.
Language:English
Date of Publication (YYYY-MM-DD):2009
Title of Journal:Engineering Failure Analysis
Volume:16
Issue / Number:8
Start Page:2559
End Page:2566
Copyright:Elsevier B.V.
Review Status:Peer-review
Audience:Experts Only
External Publication Status:published
Document Type:Article
Communicated by:N. N.
Affiliations:MPI für Plasmaphysik/Material Research (MF)
External Affiliations:CEIT and TECNUN (University of Navarra) Peseo Manuel de Lardizabal, 15, 20018 San Sebastian, Spain
Identifiers:DOI:10.1016/j.engfailanal.2009.04.026
URL:http://dx.doi.org/10.1016/j.engfailanal.2009.04.02...
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