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          Institute: MPI für Physik     Collection: MPI für Physik     Display Documents

ID: 542823.0, MPI für Physik / MPI für Physik
A module concept for the upgrades of the ATLAS pixel system using the novel SLID-ICV vertical integration technology
Authors:Beimforde, M.; Andricek, L.; Macchiolo, A.; Moser, H. -G.; Nisius, R.; Richter, R. H.; Weigell, P.
Date of Publication (YYYY-MM-DD):2010
Title of Journal:Journal of Instrumentation
Journal Abbrev.:J.Inst.
Issue / Number:5
Start Page:C12025
(Start) Date of Conference/Meeting
Audience:Not Specified
Intended Educational Use:No
Abstract / Description:The presented R&D activity is focused on the development of a new pixel module concept for the foreseen upgrades of the ATLAS detector towards the Super LHC employing thin n-in-p silicon sensors together with a novel vertical integration technology. A first set of pixel sensors with active thicknesses of 75 μm and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut für Physik (MPP) and the MPI Semiconductor Laboratory (HLL). Charge Collection Efficiency (CCE) measurements of these sensors irradiated with 26 MeV protons up to a particle fluence of 10e16neq/cm^2 have been performed, yielding higher values than expected from the present radiation damage models. The novel integration technology, developed by the Fraunhofer Institut EMFT, consists of the Solid-Liquid InterDiffusion (SLID) interconnection, being an alternative to the standard solder bump-bonding, and Inter-Chip Vias (ICVs) for routing signals vertically through electronics. This allows for extracting the digitized signals from the back side of the readout chips, avoiding wire-bonding cantilevers at the edge of the devices and thus increases the active area fraction. First interconnections have been performed with wafers containing daisy chains to investigate the efficiency of SLID at wafer-to-wafer and chip-to-wafer level. In a second interconnection process the present ATLAS FE-I3 readout chips were connected to dummy sensor wafers at chip-to-wafer level. Preparations of ICV within the ATLAS readout chips for back side contacting and the future steps towards a full demonstrator module will be presented.
Classification / Thesaurus:Semiconductor Detectors
External Publication Status:published
Document Type:Conference-Paper
Communicated by:N.N.
Affiliations:MPI für Physik
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