Institute: MPI für Physik     Collection: MPI für Physik     Display Documents

ID: 543316.0, MPI für Physik / MPI für Physik
Development of thin sensors and a novel interconnection technology for the upgrade of the ATLAS pixel system
Authors:
Audience:Not Specified
Intended Educational Use:No
Abstract / Description:A new pixel module concept is presented utilizing thin sensors and a novel vertical integration technique for the ATLAS pixel detector in view of the foreseen LHC luminosity upgrades. A first set of pixel sensors with active thicknesses of $75\,\rm \mu m$ and $150\,\rm \mu m$ has been produced from wafers of standard thickness using a thinning process developed at the Max-Planck-Institut Halbleiterlabor (HLL) and the Max-Planck-Institut f\"ur Physik (MPP). Pre-irradiation characterizations of these sensors show a very good device yield and high break down voltage. First proton irradiations up to a fluence of $10 ^{15} \,\rm n_{eq}/cm^2$ have been carried out and their impact on the electrical properties of thin sensors has been studied.

The novel ICV-SLID vertical integration technology will allow for routing signals vertically to the back side of the readout chips. With this, four-side buttable detector devices with an increased active area fraction are made possible. A first production of SLID test structures was performed and showed a high connection efficiency for different pad sizes and a mild sensitivity to disturbances of the surface planarity.
Classification / Thesaurus:Semiconductor Detectors
Document Type:Conference-Paper
Communicated by:N.N.
Affiliations:
Identifiers:LOCALID:MPP-2010-66
URL:http://dx.doi.org/10.1016/j.nima.2010.04.087
URL:http://publications.mppmu.mpg.de/?action=search&mp...
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