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          Institute: MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung)     Collection: Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)     Display Documents



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ID: 55934.0, MPI für Intelligente Systeme (ehemals Max-Planck-Institut für Metallforschung) / Ehemalige Abt. Arzt (Micro/nanomechanics of Thin Films and Biological Systems)
Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect
Authors:Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Language:English
Publisher:MRS
Place of Publication:Warrendale, Pa.
Date of Publication (YYYY-MM-DD):2003
Title of Proceedings:Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Start Page:107
End Page:114
Title of Series:Materials Research Society Symposium Proceedings
Corporate Body ed. Series:Materials Research Society
Name of Conference/Meeting:Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics. Symposium at the 2003 Spring Meeting
Place of Conference/Meeting:San Francisco, Calif.
(Start) Date of Conference/Meeting
 (YYYY-MM-DD):
2003-04-21
End Date of Conference/Meeting 
 (YYYY-MM-DD):
2003-04-25
Review Status:not specified
Audience:Experts Only
External Publication Status:published
Document Type:Conference-Paper
Communicated by:Patrick Wellner
Affiliations:MPI für Metallforschung/Abt. Arzt
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