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Quantitative analysis of layering and in-plane structural ordering at an alumina–aluminum solid–liquid interface
Authors: Kauffmann, Y.; Oh, S. H.; Koch, C. T.; Hashibon, A.; Scheu, C.; Rühle, M.; Kaplan, W. D.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Acta Materialia
Volume: 59
Issue / Number: 11
Start Page: 4378
End Page: 4386
Document Type: Article
ID: 575331.0
Quantitative analysis of layering and in-plane structural ordering at an alumina-aluminum solid-liquid interface
Authors: Kauffmann, Y.; Oh, S. H.; Koch, C.; Hashibon, A.; Scheu, C.; Rühle, M.; Kaplan, W.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Acta Materialia
Volume: 59
Start Page: 4378
End Page: 4386
Document Type: Article
ID: 609572.0
Ab initio study of electronic densities of states at copper-alumina interfaces
Authors: Hashibon, A.; Elsässer, C.; Rühle, M.
Date of Publication (YYYY-MM-DD): 2007-01-03
Title of Journal: Acta Materialia
Volume: 55
Start Page: 1657
End Page: 1665
Document Type: Article
ID: 319463.0
Structure at abrupt copper-alumina interfaces: an ab initio study
Authors: Hashibon, A.; Elsässer, C.; Rühle, M.
Date of Publication (YYYY-MM-DD): 2005
Title of Journal: Acta Materialia
Volume: 53
Start Page: 5323
End Page: 5325
Document Type: Article
ID: 262776.0
Entries: 1-4  
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