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Entries: 1-3  
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Local, submicron, strain gradients as the cause of Sn whisker growth.
Authors: Sobiech, M.; Wohlschlögel, M.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.; Liu, W.; Ice, G. E.
Date of Publication (YYYY-MM-DD): 2009
Title of Journal: Applied Physics Letters
Volume: 94
Sequence Number of Article: 221901
Document Type: Article
ID: 430730.0
Driving force for Sn whisker growth in the system Cu-Sn
Authors: Sobiech, M.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.
Date of Publication (YYYY-MM-DD): 2008
Title of Journal: Applied Physics Letters
Volume: 93
Sequence Number of Article: 011906
Document Type: Article
ID: 372479.0
 
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The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation?
Authors: Sobiech, M.; Welzel, U.; Schuster, R.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.; Müller, V.
Place of Publication: Piscataway, NJ
Publisher: IEEE Service Center
Date of Publication (YYYY-MM-DD): 2007
Name of Conference/Meeting: 57th IEEE Electronic Components and Technology Conference
Title of Proceedings: 2007 IEEE Electronic Components & Technology Conference, ECTC '07. Proceedings
Start Page: 192
End Page: 197
Document Type: Conference-Paper
ID: 319234.0
 
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Entries: 1-3  
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