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Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2004-07
Title of Journal: Microelectronic Engineering
Volume: 75
Issue / Number: 1
Start Page: 24
End Page: 30
Document Type: Article
ID: 200784.0
Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration
Authors: Budiman, A. S.; Tamura, N.; Valek, B. C.; Gadre, K.; Maiz, J.; Spolenak, R.; Caldwell, W. A.; Nix, W. D.; Patel, J. R.
Place of Publication: Boston
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2004-06-20
Name of Conference/Meeting: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics. Symposium at the MRS Spring Meeting 2004
Title of Proceedings: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics
Start Page: F7.3.1
End Page: F7.3.6
Title of Series: Materials Research Society Symposium Proceedings
Volume (in Series): 812
Document Type: Conference-Paper
ID: 174879.0
Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Bravman, J. C.; Patel, J. R.
Publisher: Materials Research Society
Date of Publication (YYYY-MM-DD): 2004-06-20
Name of Conference/Meeting: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics. Symposium at the MRS Spring Meeting 2004
Title of Proceedings: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics
Start Page: F7.4.1
End Page: F7.4.10
Title of Series: Materials Research Society Symposium Proceedings
Volume (in Series): 812
Document Type: Conference-Paper
ID: 174881.0
Electromigration-induced plastic deformation in passivated metal lines
Authors: Valek, B. C.; Bravman, J. C.; Tamura, N.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Spolenak, R.; Brown, W. L.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-11-25
Title of Journal: Applied Physics Letters
Volume: 81
Issue / Number: 22
Start Page: 4168
End Page: 4170
Document Type: Article
ID: 55941.0
Early stage of plastic deformation in thin films undergoing electromigration
Authors: Valek, B. C.; Tamura, N.; Spolenak, R.; Caldwell, W. A.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Braman, J. C.; Batterman, B. W.; Nix, W. D.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-09-15
Title of Journal: Journal of Applied Physics
Volume: 94
Issue / Number: 6
Start Page: 3757
End Page: 3761
Document Type: Article
ID: 112766.0
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-05-01
Title of Journal: Journal of Applied Physics
Volume: 93
Issue / Number: 9
Start Page: 5701
End Page: 5706
Document Type: Article
ID: 112654.0
Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Patel, R.
Place of Publication: Warrendale, Pa.
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2003
Name of Conference/Meeting: Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures. MRS Symposium
Title of Proceedings: Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures
Start Page: G13.1.1
End Page: G13.1.6
Title of Series: Materials Research Society Symposium Proceedings
Document Type: Conference-Paper
ID: 55933.0
Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Place of Publication: Warrendale, Pa.
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2003
Name of Conference/Meeting: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics. Symposium at the 2003 Spring Meeting
Title of Proceedings: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Start Page: 107
End Page: 114
Title of Series: Materials Research Society Symposium Proceedings
Document Type: Conference-Paper
ID: 55934.0
Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films
Authors: Tamura, N.; MacDowell, A. A.; Spolenak, R.; Valek, B. C.; Bravman, J. C.; Brown, W. L.; Celestre, R. S.; Padmore, H. A.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003
Title of Journal: Journal of Synchrotron Radiation
Volume: 10
Start Page: 137
End Page: 143
Document Type: Article
ID: 55935.0
Submicron X-ray diffraction and its applications to problems in materials and environmental science.
Authors: Tamura, N.; Celestre, R. S.; MacDowell, A. A.; Padmore, H. A.; Spolenak, R.; Valek, B. C.; Chang, N. M.; Manceau, A.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2002-03-03
Title of Journal: Review of Scientific Instruments
Volume: 73
Issue / Number: 3
Start Page: 1369
End Page: 1372
Document Type: Article
ID: 55945.0
Entries: 1-10  
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