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High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications
Authors: Singh, R.; Radu, I.; Reiche, M.; Himcinschi, C.; Kuck, B.; Tillack, B.; Gösele, U.; Christiansen, S. H.
Date of Publication (YYYY-MM-DD): 2007
Title of Journal: Applied Surface Science
Volume: 253
Start Page: 3595
End Page: 3599
Document Type: Article
ID: 352265.0
Silicon wafer bonding using deposited and thermal oxide: A comparative study
Authors: Radu, I.; Singh, R.; Reiche, M.; Gö”sele, U.; Kuck, B.; Grabolla, T.; Tillack, B.; Christiansen, S.H.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 400
End Page: 405
Title of Series: Proceedings volume / Electrochemical Society
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275266.0
Entries: 1-2  
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