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Uniaxially strained silicon by wafer bonding and layer transfer.
Authors: Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S. H.
Date of Publication (YYYY-MM-DD): 2007
Title of Journal: Solid State Electronics
Volume: 51
Issue / Number: 2
Start Page: 226
End Page: 230
Document Type: Article
ID: 350460.0
Strain relaxation in nanopatterned strained silicon round pillars.
Authors: Himcinschi, C.; Singh, R.; Radu, I.; Milenin, A. P.; Erfurth, W.; Reiche, M.; Gösele, U.; Christiansen, S. H.; Muster, F.; Petzold, M.
Date of Publication (YYYY-MM-DD): 2007
Title of Journal: Applied Physics Letters
Volume: 90
Issue / Number: 2
Sequence Number of Article: 021902/1-3
Document Type: Article
ID: 350463.0
Uniaxially strained silicon by wafer bonding and layer transfer
Authors: Himcinschi, C.; Radu, I.; Muster, F.; Singh, R.; Reiche, M.; Petzold, M.; Gösele, U.; Christiansen, S. H.
Place of Publication: Grenoble, France
Date of Publication (YYYY-MM-DD): 2006
Title of Proceedings: Proceedings European Meeting on Silicon-on-Insulator Devices
(EUROSOI)
Start Page: 39
End Page: 40
Document Type: Conference-Paper
ID: 312872.0
Entries: 1-3  
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