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Length-scale-controlled fatigue mechanisms in thin copper films
Authors: Zhang, G. P.; Volkert, C. A.; Schwaiger, R.; Wellner, P.; Arzt, E.
Date of Publication (YYYY-MM-DD): 2006-05-16
Title of Journal: Acta Materialia
Volume: 54
Start Page: 3127
End Page: 3139
Document Type: Article
ID: 284885.0
Microscopic investigation of strain localization and fatigue damage in thin Cu films
Authors: Zhang, G. P.; Volkert, C. A.; Schwaiger, R.; Kraft, O.
Date of Publication (YYYY-MM-DD): 2005-09-14
Title of Journal: Materials Science Forum
Volume: 475-479
Start Page: 3647
End Page: 3650
Document Type: Article
ID: 240396.0
Damage behavior of 200-nm thin copper films under cyclic loading
Authors: Zhang, G. P.; Volkert, C. A.; Schwaiger, R.; Arzt, E.; Kraft, O.
Date of Publication (YYYY-MM-DD): 2005-01
Title of Journal: Journal of Materials Research
Volume: 20
Issue / Number: 1
Start Page: 201
End Page: 207
Document Type: Article
ID: 240397.0
Fatigue behavior of microsized austenitic stainless steel specimens
Authors: Zhang, G. P.; Takashima, K.; Shimojo, M.; Higo, Y.
Date of Publication (YYYY-MM-DD): 2003-02
Title of Journal: Materials Letters
Volume: 57
Issue / Number: 9-10
Start Page: 1555
End Page: 1560
Document Type: Article
ID: 119712.0
Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films
Authors: Zhang, G. P.; Schwaiger, R.; Volkert, C. A.; Kraft, O.
Date of Publication (YYYY-MM-DD): 2003
Title of Journal: Philosophical Magazine Letters
Volume: 83
Issue / Number: 8
Start Page: 477
End Page: 483
Document Type: Article
ID: 56097.0
Entries: 1-5  
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