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Entries: 1-3  
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Hillock formation and thermal stresses in thin Au films on Si substrates
Authors: Sauter, L.; Balk, T. J.; Dehm, G.; Nucci, J. A.; Arzt, E.
Place of Publication: Warrendale, Pa.
Publisher: Materials Research Society
Date of Publication (YYYY-MM-DD): 2005
Name of Conference/Meeting: Thin Films—Stresses and Mechanical Properties XI. Symposium O from the MRS Spring 2005
Title of Proceedings: Thin Films—Stresses and Mechanical Properties XI
Start Page: O5.2.2
End Page: O5.2.6
Title of Series: Materials Research Society Symposium Proceedings
Volume (in Series): 875
Document Type: Conference-Paper
ID: 248774.0
Growth of electromigration-induced hillocks in Al interconnects
Authors: Nucci, J. A.; Straub, A.; Bischoff, E.; Arzt, E.; Volkert, C. A.
Date of Publication (YYYY-MM-DD): 2002-10
Title of Journal: Journal of Materials Research
Volume: 17
Issue / Number: 10
Start Page: 2727
End Page: 2735
Document Type: Article
ID: 6693.0
 
Full text / Content available
Growth of electromigration-induced hillocks in Al interconnects
Authors: Nucci, J. A.; Straub, A.; Bischoff, E.; Arzt, E.; Volkert, C. A.
Date of Publication (YYYY-MM-DD): 2002-10
Title of Journal: Journal of Materials Research
Volume: 17
Issue / Number: 10
Start Page: 2727
End Page: 2735
Document Type: Article
ID: 121073.0
Entries: 1-3  
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