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Entries: 1-8  
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Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2004-07
Title of Journal: Microelectronic Engineering
Volume: 75
Issue / Number: 1
Start Page: 24
End Page: 30
Document Type: Article
ID: 200784.0
Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Bravman, J. C.; Patel, J. R.
Publisher: Materials Research Society
Date of Publication (YYYY-MM-DD): 2004-06-20
Name of Conference/Meeting: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics. Symposium at the MRS Spring Meeting 2004
Title of Proceedings: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics
Start Page: F7.4.1
End Page: F7.4.10
Title of Series: Materials Research Society Symposium Proceedings
Volume (in Series): 812
Document Type: Conference-Paper
ID: 174881.0
Electromigration-induced plastic deformation in passivated metal lines
Authors: Valek, B. C.; Bravman, J. C.; Tamura, N.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Spolenak, R.; Brown, W. L.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-11-25
Title of Journal: Applied Physics Letters
Volume: 81
Issue / Number: 22
Start Page: 4168
End Page: 4170
Document Type: Article
ID: 55941.0
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-05-01
Title of Journal: Journal of Applied Physics
Volume: 93
Issue / Number: 9
Start Page: 5701
End Page: 5706
Document Type: Article
ID: 112654.0
Local plasticity of Al thin films as revealed by X-ray microdiffraction
Authors: Spolenak, R.; Brown, W. L.; Tamura, N.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Valek, B.; Bravman, J. C.; Marieb, T.; Fujimoto, H.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-03-07
Title of Journal: Physical Review Letters
Volume: 90
Issue / Number: 9
Sequence Number of Article: 096102
Document Type: Article
ID: 55936.0
Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Place of Publication: Warrendale, Pa.
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2003
Name of Conference/Meeting: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics. Symposium at the 2003 Spring Meeting
Title of Proceedings: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Start Page: 107
End Page: 114
Title of Series: Materials Research Society Symposium Proceedings
Document Type: Conference-Paper
ID: 55934.0
Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films
Authors: Tamura, N.; MacDowell, A. A.; Spolenak, R.; Valek, B. C.; Bravman, J. C.; Brown, W. L.; Celestre, R. S.; Padmore, H. A.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003
Title of Journal: Journal of Synchrotron Radiation
Volume: 10
Start Page: 137
End Page: 143
Document Type: Article
ID: 55935.0
High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron X-ray diffraction.
Authors: Tamura, N.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Valek, B.; Bravman, J. C.; Spolenak, R.; Brown, W. L.; Marieb, T.; Fujimoto, H.; Batterman, B. W.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2002-05-20
Title of Journal: Applied Physics Letters
Volume: 80
Issue / Number: 20
Start Page: 3724
End Page: 3726
Document Type: Article
ID: 55944.0
Entries: 1-8  
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