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Low-temperature direct wafer bonding with ambient pressure plasma activation
Authors: Gabriel, M.; Brad, J.; Suess, R.; Reiche, M.; Eichler, M.
Publisher: MANCEF
Date of Publication (YYYY-MM-DD): 2004
Title of Proceedings: Proceedings 9th International Conference on the Commercialization of Micro and Nano Systems
Start Page: 353
End Page: 357
Document Type: Conference-Paper
ID: 223954.0
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