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Entries: 1-10  
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Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain
Authors: Glushko, O.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.
Date of Publication (YYYY-MM-DD): 2014-02
Title of Journal: Thin Solid Films
Volume: 552
Issue / Number: 3
Start Page: 141
End Page: 145
Document Type: Article
ID: 673120.0
Deformation behavior of thin Cu/Cr films on polyimide
Authors: Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.
(Start) Date of Event
(YYYY-MM-DD):
 2013-10-14
Name of Conference/Meeting: Small Scale Plasticity School
Document Type: Poster
ID: 681733.0
The mechanical and adhesion behavior of a Cr interlayer between Cu and polyimide
Authors: Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.
(Start) Date of Event
(YYYY-MM-DD):
 2013-10-06
Name of Conference/Meeting: Nano- and Micromechanical Testing in Materials Research and Development IV
Document Type: Poster
ID: 681729.0
In-situ squared: multi property thin film measurements during straining
Authors: Cordill, M. J.; Glushko, O.; Kreith, J.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Struntz, T.; Fantner, E.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2013-10-06
Name of Conference/Meeting: Nano- and Micromechanical Testing in Materials Research and Development IV
Place of Conference/Meeting: Olhão, Portugal
Document Type: Talk at Event
ID: 681731.0
The adhesion of a Cu/Cr film stack on polyimide
Authors: Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2013-09-08
Name of Conference/Meeting: EUROMAT2013
Place of Conference/Meeting: Sevilla, Spain
Document Type: Talk at Event
ID: 669385.0
In situ studies on crack resistance of CrN-based hard coatings
Authors: Paulitsch, J.; Schlögl, M.; Keckes, J.; Kirchlechner, C.; Cordill, M. J.; Mayrhofer, P. H.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2013-09-08
Name of Conference/Meeting: EUROMAT2013
Place of Conference/Meeting: Sevilla, Spain
Document Type: Talk at Event
ID: 669387.0
Deformation behavior of a Cr interlayer buried under Cu films on polyimide
Authors: Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2013-07-18
Name of Conference/Meeting: GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects
Place of Conference/Meeting: MPIE, Düsseldorf, Germany
Document Type: Talk at Event
ID: 669350.0
An elevated temperature study of a Ti adhesion layer on polyimide
Authors: Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.
Date of Publication (YYYY-MM-DD): 2013-03-15
Title of Journal: Thin Solid Films
Volume: 531
Start Page: 354
End Page: 361
Document Type: Article
ID: 634669.0
Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate
Authors: Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.
(Start) Date of Event
(YYYY-MM-DD):
 2013-03-03
Name of Conference/Meeting: TMS 2013: 142nd Annual Meeting & Exhibition
Document Type: Poster
ID: 655287.0
In-situ Tensile Straining of Metal Films on Polymer Substrates under an AFM
Authors: Cordill, M. J.; Marx, V. M.
Date of Publication (YYYY-MM-DD): 2013
Name of Conference/Meeting: 2012 MRS Fall Meeting & Exhibit
Title of Journal: Materials Research Society Symposium Proceedings
Volume (in Journal): 1527
Document Type: Conference-Paper
ID: 681725.0
Entries: 1-10  
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