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Entries: 1-8  
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Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering
Authors: Sobiech, M.; Teufel, J.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Journal of Electronic Materials
Volume: 40
Issue / Number: 11
Start Page: 2300
End Page: 2313
Document Type: Article
ID: 573305.0
Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering
Authors: Sobiech, M.; Teufel, J.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Journal of Electronic Materials
Volume: 40
Start Page: 2300
End Page: 2313
Document Type: Article
ID: 579759.0
Phase formation at the Sn/Cu interface during room temperature aging: microstructural evolution, whiskering, and interface thermodynamics
Authors: Sobiech, M.; Krüger, C.; Welzel, U.; Wang, J. Y.; Mittemeijer, E. J.; Hügel, W.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Journal of Materials Research
Volume: 26
Start Page: 1482
End Page: 1493
Document Type: Article
ID: 579766.0
Whisker formation on Sn thin films
Authors: Sobiech, M.
Name of University: Universität Stuttgart
Place of University: Stuttgart
Date of Approval (YYYY-MM-DD): 2010-11-26
Document Type: PhD-Thesis
ID: 532046.0
Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates
Authors: Sobiech, M.; Krüger, C.; Welzel, U.; Wang, J. Y.; Mittemeijer, E. J.; Hügel, W.
Date of Publication (YYYY-MM-DD): 2010
Title of Journal: Journal of Materials Research
Volume: 25
Start Page: 2166
End Page: 2174
Document Type: Article
ID: 531994.0
Local, submicron, strain gradients as the cause of Sn whisker growth.
Authors: Sobiech, M.; Wohlschlögel, M.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.; Liu, W.; Ice, G. E.
Date of Publication (YYYY-MM-DD): 2009
Title of Journal: Applied Physics Letters
Volume: 94
Sequence Number of Article: 221901
Document Type: Article
ID: 430730.0
Driving force for Sn whisker growth in the system Cu-Sn
Authors: Sobiech, M.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.
Date of Publication (YYYY-MM-DD): 2008
Title of Journal: Applied Physics Letters
Volume: 93
Sequence Number of Article: 011906
Document Type: Article
ID: 372479.0
 
Full text / Content available
The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation?
Authors: Sobiech, M.; Welzel, U.; Schuster, R.; Mittemeijer, E. J.; Hügel, W.; Seekamp, A.; Müller, V.
Place of Publication: Piscataway, NJ
Publisher: IEEE Service Center
Date of Publication (YYYY-MM-DD): 2007
Name of Conference/Meeting: 57th IEEE Electronic Components and Technology Conference
Title of Proceedings: 2007 IEEE Electronic Components & Technology Conference, ECTC '07. Proceedings
Start Page: 192
End Page: 197
Document Type: Conference-Paper
ID: 319234.0
 
Full text / Content available
Entries: 1-8  
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