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Low-temperature wafer bonding via DBD surface activation
Authors: Radu, I.; Reiche, M.; Zoberbier, M.; Gabriel, M.; G”ösele, U.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 295
End Page: 302
Title of Series: Proceedings volume / Electrochemical Society
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275267.0
Mechanisms of low-temperature wafer bonding
Authors: Reiche, M.; Radu, I.; Gabriel, M.; Zoberbier, M.; Hansen, S.; Eichler, M.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 326
End Page: 337
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275262.0
Entries: 1-2  
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