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Entries: 1-8  
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In-situ observation of stress-induced stochastic twin boundary motion in off stoichiometric NiMnGa single crystals
Authors: Barabash, R. I.; Kirchlechner, C.; Robach, O.; Ulrich, O.; Micha, J. S.; Sozinov, A.; Barabash, O. M.
Date of Publication (YYYY-MM-DD): 2013-07-08
Title of Journal: Applied Physics Letters
Volume: 103
Issue / Number: 2
Start Page: 021909-1
End Page: 021909-5
Document Type: Article
ID: 673115.0
Experimental Characterization and Crystal Plasticity Modeling of Heterogeneous Deformation in Polycrystalline α-Ti
Authors: Wang, L.; Barabash, R. I.; Yang, Y.; Bieler, T.R.; Crimp, M.A.; Eisenlohr, P.; Liu, W.; Ice, G.E.
Date of Publication (YYYY-MM-DD): 2011
Title of Journal: Metallurgical and Materials Transactions A
Volume: 42
Issue / Number: 3
Start Page: 626
End Page: 635
Document Type: Article
ID: 580680.0
Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2004-07
Title of Journal: Microelectronic Engineering
Volume: 75
Issue / Number: 1
Start Page: 24
End Page: 30
Document Type: Article
ID: 200784.0
Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Bravman, J. C.; Patel, J. R.
Publisher: Materials Research Society
Date of Publication (YYYY-MM-DD): 2004-06-20
Name of Conference/Meeting: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics. Symposium at the MRS Spring Meeting 2004
Title of Proceedings: Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics
Start Page: F7.4.1
End Page: F7.4.10
Title of Series: Materials Research Society Symposium Proceedings
Volume (in Series): 812
Document Type: Conference-Paper
ID: 174881.0
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Date of Publication (YYYY-MM-DD): 2003-05-01
Title of Journal: Journal of Applied Physics
Volume: 93
Issue / Number: 9
Start Page: 5701
End Page: 5706
Document Type: Article
ID: 112654.0
Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Spolenak, R.; Patel, R.
Place of Publication: Warrendale, Pa.
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2003
Name of Conference/Meeting: Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures. MRS Symposium
Title of Proceedings: Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures
Start Page: G13.1.1
End Page: G13.1.6
Title of Series: Materials Research Society Symposium Proceedings
Document Type: Conference-Paper
ID: 55933.0
Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect
Authors: Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.
Place of Publication: Warrendale, Pa.
Publisher: MRS
Date of Publication (YYYY-MM-DD): 2003
Name of Conference/Meeting: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics. Symposium at the 2003 Spring Meeting
Title of Proceedings: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Start Page: 107
End Page: 114
Title of Series: Materials Research Society Symposium Proceedings
Document Type: Conference-Paper
ID: 55934.0
X-ray scattering from misfit dislocations in heteroepitaxial films: The case of Nb(110) on Al2O3
Authors: Barabash, R. I.; Donner, W.; Dosch, H.
Date of Publication (YYYY-MM-DD): 2001-01-22
Title of Journal: Applied Physics Letters
Volume: 78
Issue / Number: 4
Start Page: 443
End Page: 445
Document Type: Article
ID: 21801.0
Entries: 1-8  
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