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Wafer direct bonding with ambient pressure plasma activation
Authors: Gabriel, M.; Johnson, B.; Suss, R.; Reiche, M.; Eichler, M.
Date of Publication (YYYY-MM-DD): 2006
Title of Journal: Microsystem Technologies
Volume: 12
Issue / Number: 5
Start Page: 397
End Page: 400
Document Type: Article
ID: 312789.0
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