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Development of Cu/Cu interconnections using an indium interlayer
Authors: Sommadossi, S.; Khanna, P. K.; Bhatnagar, S. K.; Litynska, L.; Zieba, P.; Gust, W.; Mittemeijer, E. J.
Place of Publication: Weinheim
Publisher: Wiley-VCH
Date of Publication (YYYY-MM-DD): 2000
Name of Conference/Meeting: EUROMAT 99, 6th European Congress on Advanced Materials and Processes
Title of Proceedings: Euromat 99. 6th European Congress on Advanced Materials and Processes. Vol. 4
Start Page: 214
End Page: 218
Document Type: Conference-Paper
ID: 200662.0
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