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Entries: 1-9  
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Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections
Authors: Sommadossi, S.; Gust, W.; Mittemeijer, E. J.
Date of Publication (YYYY-MM-DD): 2003
Title of Journal: Materials Science and Technology
Volume: 19
Start Page: 528
End Page: 534
Document Type: Article
ID: 49425.0
Transmission electron microscopy investigation of the microstructure and chemistry of Si/Cu/In/Cu/Si interconnections
Authors: Sommadossi, S.; Litynska, L.; Zieba, P.; Gust, W.; Mittemeijer, E. J.
Date of Publication (YYYY-MM-DD): 2003
Title of Journal: Materials Chemistry and Physics
Volume: 81
Start Page: 566
End Page: 568
Document Type: Article
ID: 49428.0
Investigation on Diffusion Soldering in Cu/In/Cu and Cu/In-48Sn/Cu Systems
Authors: Sommadossi, S.
Name of University: Universität Stuttgart
Place of University: Stuttgart
Date of Approval (YYYY-MM-DD): 2002-07-24
Document Type: PhD-Thesis
ID: 13382.0
Mechanical properties of Cu/In-48 Sn/Cu diffusion-soldered joints
Authors: Sommadossi, S.; Huici, J.; Khanna, P. K.; Gust, W.; Mittemeijer, E. J.
Date of Publication (YYYY-MM-DD): 2002-06
Title of Journal: Zeitschrift für Metallkunde
Volume: 93
Issue / Number: 6
Start Page: 496
End Page: 501
Document Type: Article
ID: 6746.0
Phase characterization of diffusion soldered Ni/Al/Ni interconnections
Authors: Lopez, G. A.; Sommadossi, S.; Gust, W.; Mittemeijer, E. J.; Zieba, P.
Date of Publication (YYYY-MM-DD): 2002-04
Title of Journal: Interface Science
Volume: 10
Issue / Number: 1
Start Page: 13
End Page: 19
Document Type: Article
ID: 6882.0
Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections
Authors: Lopez, G. A.; Sommadossi, S.; Zieba, P.; Gust, W.; Mittemeijer, E. J.
Date of Publication (YYYY-MM-DD): 2002-02-17
Title of Journal: Materials Chemistry and Physics
Volume: 78
Issue / Number: 2
Start Page: 459
End Page: 463
Document Type: Article
ID: 6644.0
Characterization of the Reaction Process in Diffusion-Soldered Cu/In-48 at.% Sn/Cu Joints
Authors: Sommadossi, S.; Gust, W.; Mittemeijer, E. J.
Date of Publication (YYYY-MM-DD): 2002
Title of Journal: Materials Chemistry and Physics
Volume: 77
Start Page: 924
End Page: 929
Document Type: Article
ID: 250127.0
Novel Ni/Al/Ni diffusion soldered joints for high temperature applications
Authors: Khanna, P. K.; Sommadossi, S.; Lopez, G.; Bielanska, E.; Zieba, P.; Chang, L. S.; Gust, W.; Mittemeijer, E. J.
Place of Publication: Weinheim
Publisher: Wiley-VCH
Date of Publication (YYYY-MM-DD): 2000
Name of Conference/Meeting: EUROMAT 99, 6th European Congress on Advanced Materials and Processes
Title of Proceedings: Euromat 99. 6th European Congress on Advanced Materials and Processes. Vol. 4
Start Page: 220
End Page: 224
Document Type: Conference-Paper
ID: 200615.0
Development of Cu/Cu interconnections using an indium interlayer
Authors: Sommadossi, S.; Khanna, P. K.; Bhatnagar, S. K.; Litynska, L.; Zieba, P.; Gust, W.; Mittemeijer, E. J.
Place of Publication: Weinheim
Publisher: Wiley-VCH
Date of Publication (YYYY-MM-DD): 2000
Name of Conference/Meeting: EUROMAT 99, 6th European Congress on Advanced Materials and Processes
Title of Proceedings: Euromat 99. 6th European Congress on Advanced Materials and Processes. Vol. 4
Start Page: 214
End Page: 218
Document Type: Conference-Paper
ID: 200662.0
Entries: 1-9  
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