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Entries: 1-9  
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Grain orientation, texture and internal stress optically evaluated by micro-Raman spectroscopy.
Authors: Becker, M.; Scheel, H.; Christiansen, S.H.; Strunk, H. P.
Date of Publication (YYYY-MM-DD): 2007
Title of Journal: Journal of Applied Physics
Volume: 101
Issue / Number: 6
Sequence Number of Article: 063531/1–10
Document Type: Article
ID: 349994.0
Investigation of hydrogen implantation-induced blistering in SiGe
Authors: Radu, I.; Reiche, M.; Scholz, R.; Webb, D.; G”ösele, U.; Christiansen, S.H.
Date of Publication (YYYY-MM-DD): 2005
Title of Journal: Materials Science & Engineering B
Volume: 124-125
Start Page: 162
End Page: 165
Document Type: Article
ID: 275264.0
Silicon wafer bonding using deposited and thermal oxide: A comparative study
Authors: Radu, I.; Singh, R.; Reiche, M.; Gö”sele, U.; Kuck, B.; Grabolla, T.; Tillack, B.; Christiansen, S.H.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 400
End Page: 405
Title of Series: Proceedings volume / Electrochemical Society
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275266.0
Strained silicon on insulator (SSOI) by waferbonding
Authors: Christiansen, S.H.; Singh, R.; Radu, I.; Reiche, M.; Gö”sele, U.; Webb, D.; Bukalo, S.; Dietrich, B.
Date of Publication (YYYY-MM-DD): 2005
Title of Journal: Materials Science in Semiconductor Processing
Volume: 8
Issue / Number: 1-3
Start Page: 197
End Page: 202
Document Type: Article
ID: 275385.0
Wafer bonding and layer transfer approach for strained silicon-on-insulator (sSOI) fabrication
Authors: Singh, R.; Radu, I.; Reiche, M.; G”ösele, U.; Christiansen, S.H.; Webb, D.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 89
End Page: 95
Title of Series: Proceedings volume / Electrochemical Society
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275240.0
Wafer bonding involving strain-relaxed SiGe
Authors: Radu, I.; Singh, R.; Reiche, M.; G”ösele, U.; Christiansen, S.H.
Date of Publication (YYYY-MM-DD): 2005
Title of Journal: Materials Science & Engineering B
Volume: 124-125
Start Page: 158
End Page: 161
Document Type: Article
ID: 275265.0
Nanowire synthesis - constructive destruction
Authors: Christiansen, S.H.; Gösele, U.
Date of Publication (YYYY-MM-DD): 2004
Title of Journal: Nature Materials.
Volume: 3
Issue / Number: 6
Start Page: 357
End Page: 359
Document Type: Article
ID: 223978.0
Strained silicon on insulator (sSOI) by wafer bonding
Authors: Christiansen, S.H.; Reiche, M.; Radu, I.; Singh, R.; Gösele, U.; Webb, D.; Mantl, S.
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2004
Title of Proceedings: Proceedings Electrochemical Society, SiGe: Materials, Processing, and Devices
Start Page: 759
End Page: 768
Document Type: Conference-Paper
ID: 223979.0
Strain relaxation and threading dislocation density in helium implanted and annealed Si1-xGex/Si(001) heterostructures
Authors: Cai, J.; Mooney, P.M.; Christiansen, S.H.; Chen, H.; Chu, J.O.; Ott, J.A.
Date of Publication (YYYY-MM-DD): 2004
Title of Journal: Journal of Applied Physics.
Volume: 95
Issue / Number: 10
Start Page: 5347
End Page: 5351
Document Type: Article
ID: 223986.0
Entries: 1-9  
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