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Nanoscale Conductivity and Strain Field Mapping by IR and THz Near-Field Nanoscopy |
Authors: Huber, A. J.; Keilmann, F.; Wittborn, J.; Aizpurua, J.; Ziegler, A.; Köck, T.; Hillenbrand, R. | (Start) Date of Conference/Meeting (YYYY-MM-DD): 2009-05-11 | Name of Conference/Meeting: International Conference on Frontiers of Characterization and Metrology for Nanoelectronics | Place of Conference/Meeting: Albany, NY | Document Type: Talk at Event | ID: 395980.0 |
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Mechanische Eigenschaften von SiC faserverstärkten Cu-Matrix Verbundwerkstoffen |
Authors: Paffenholz, V.; Brendel, A.; Köck, T.; Popescu, C.; Bolt, H. | (Start) Date of Conference/Meeting (YYYY-MM-DD): 2009-04-01 | Name of Conference/Meeting: 17. Symposium Verbundwerkstoffe und Werkstoffverbunde | Place of Conference/Meeting: Bayreuth | Document Type: Talk at Event | ID: 395235.0 |
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Infrared nanoscopy of strained semiconductors |
Authors: Huber, A. J.; Ziegler, A.; Köck, T.; Hillenbrand, R. | Date of Publication (YYYY-MM-DD): 2009-03 | Title of Journal: Nature Nanotechnology | Volume: 4 | Issue / Number: 3 | Start Page: 153 | End Page: 157 | Document Type: Article | ID: 429012.0 |
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Mechanical properties of SiC long fibre reinforced copper |
Authors: Brendel, A.; Paffenholz, V.; Köck, T.; Bolt, H. | Date of Publication (YYYY-MM-DD): 2009 | Title of Journal: Journal of Nuclear Materials | Volume: 386-388 | Start Page: 837 | End Page: 840 | Document Type: Article | ID: 322119.0 |
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Mechanische Charakterisierung von SiC-faserverstärkten Kupfermatrix-Verbundwerkstoffen |
Authors: Brendel, A.; Paffenholz, V.; Köck, T. | Place of Publication: Weinheim | Publisher: Wiley-VCH | Date of Publication (YYYY-MM-DD): 2009 | Name of Conference/Meeting: 17. Symposium Verbundwerkstoffe und Werkstoffverbunde | Title of Proceedings: Verbundwerkstoffe - 17. Symposium Verbundwerkstoffe und Werkstoffverbunde | Start Page: 127 | End Page: 133 | Document Type: Conference-Paper | ID: 395436.0 |
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Influence of different deposition parameters on the performance of a Ti-Ta-C interface layer in SiC-fiber reinforced copper matrix composites |
Authors: Köck, T.; Herrmann, A.; Brendel, A.; Bolt, H. | Title of Book: 1st International Conference on New Materials for Extreme Environments |
Start Page: 138 | End Page: 142 | Place of Publication: Stafa-Zurich | Publisher: Trans Tech Publications Ltd | Date of Publication (YYYY-MM-DD): 2009 | Document Type: InBook | ID: 429255.0 |
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Infrared nanoscopy of strained semiconductors |
Authors: Huber, A. J.; Ziegler, A.; Köck, T.; Hillenbrand, R. | Date of Publication (YYYY-MM-DD): 2009 | Title of Journal: Nature Nanotechnology | Volume: 4 | Issue / Number: 3 | Start Page: 153 | End Page: 157 | Document Type: Article | ID: 429478.0 |
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SiC fibre reinforced copper as heat sink material - a comparison of SCS 6 and SCS 0 fibres |
Authors: Brendel, A.; Paffenholz, V.; Köck, T. | (Start) Date of Event (YYYY-MM-DD): 2008-09-01 | Name of Conference/Meeting: New Congress "Materials Science and Engineering" (MSE 2008) | Document Type: Poster | ID: 339843.0 |
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Influence of different deposition parameters on the performance of a Ti-Ta-C interface layer in silicon carbide-copper metal-matrix composites |
Authors: Köck, T.; Brendel, A.; Bolt, H. | (Start) Date of Event (YYYY-MM-DD): 2008-06-02 | Name of Conference/Meeting: 1st International Conference on New Materials for Extreme Environments (ExtreMat) | Document Type: Poster | ID: 367422.0 |
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Faserverstärktes Kupfer für Bauteile in Fusionsreaktoren |
Authors: Brendel, A.; Paffenholz, V.; Köck, T.; Herrmann, A. | (Start) Date of Conference/Meeting (YYYY-MM-DD): 2008-02-27 | Name of Conference/Meeting: 14. Nationales Symposium SAMPE Deutschland e.V. "Fasern und Matrix" | Place of Conference/Meeting: Technische Universität München, Garching | Document Type: Talk at Event | ID: 335631.0 |
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