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Entries: 1-10  
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Nanoscale Conductivity and Strain Field Mapping by IR and THz Near-Field Nanoscopy
Authors: Huber, A. J.; Keilmann, F.; Wittborn, J.; Aizpurua, J.; Ziegler, A.; Köck, T.; Hillenbrand, R.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2009-05-11
Name of Conference/Meeting: International Conference on Frontiers of Characterization and Metrology for Nanoelectronics
Place of Conference/Meeting: Albany, NY
Document Type: Talk at Event
ID: 395980.0
Mechanische Eigenschaften von SiC faserverstärkten Cu-Matrix Verbundwerkstoffen
Authors: Paffenholz, V.; Brendel, A.; Köck, T.; Popescu, C.; Bolt, H.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2009-04-01
Name of Conference/Meeting: 17. Symposium Verbundwerkstoffe und Werkstoffverbunde
Place of Conference/Meeting: Bayreuth
Document Type: Talk at Event
ID: 395235.0
Infrared nanoscopy of strained semiconductors
Authors: Huber, A. J.; Ziegler, A.; Köck, T.; Hillenbrand, R.
Date of Publication (YYYY-MM-DD): 2009-03
Title of Journal: Nature Nanotechnology
Volume: 4
Issue / Number: 3
Start Page: 153
End Page: 157
Document Type: Article
ID: 429012.0
Mechanical properties of SiC long fibre reinforced copper
Authors: Brendel, A.; Paffenholz, V.; Köck, T.; Bolt, H.
Date of Publication (YYYY-MM-DD): 2009
Title of Journal: Journal of Nuclear Materials
Volume: 386-388
Start Page: 837
End Page: 840
Document Type: Article
ID: 322119.0
 
Full text / Content available
Mechanische Charakterisierung von SiC-faserverstärkten Kupfermatrix-Verbundwerkstoffen
Authors: Brendel, A.; Paffenholz, V.; Köck, T.
Place of Publication: Weinheim
Publisher: Wiley-VCH
Date of Publication (YYYY-MM-DD): 2009
Name of Conference/Meeting: 17. Symposium Verbundwerkstoffe und Werkstoffverbunde
Title of Proceedings: Verbundwerkstoffe - 17. Symposium Verbundwerkstoffe und Werkstoffverbunde
Start Page: 127
End Page: 133
Document Type: Conference-Paper
ID: 395436.0
Influence of different deposition parameters on the performance of a Ti-Ta-C interface layer in SiC-fiber reinforced copper matrix composites
Authors: Köck, T.; Herrmann, A.; Brendel, A.; Bolt, H.
Title of Book: 1st International Conference on New Materials for Extreme Environments
Start Page: 138
End Page: 142
Place of Publication: Stafa-Zurich
Publisher: Trans Tech Publications Ltd
Date of Publication (YYYY-MM-DD): 2009
Document Type: InBook
ID: 429255.0
Infrared nanoscopy of strained semiconductors
Authors: Huber, A. J.; Ziegler, A.; Köck, T.; Hillenbrand, R.
Date of Publication (YYYY-MM-DD): 2009
Title of Journal: Nature Nanotechnology
Volume: 4
Issue / Number: 3
Start Page: 153
End Page: 157
Document Type: Article
ID: 429478.0
SiC fibre reinforced copper as heat sink material - a comparison of SCS 6 and SCS 0 fibres
Authors: Brendel, A.; Paffenholz, V.; Köck, T.
(Start) Date of Event
(YYYY-MM-DD):
 2008-09-01
Name of Conference/Meeting: New Congress "Materials Science and Engineering" (MSE 2008)
Document Type: Poster
ID: 339843.0
Influence of different deposition parameters on the performance of a Ti-Ta-C interface layer in silicon carbide-copper metal-matrix composites
Authors: Köck, T.; Brendel, A.; Bolt, H.
(Start) Date of Event
(YYYY-MM-DD):
 2008-06-02
Name of Conference/Meeting: 1st International Conference on New Materials for Extreme Environments (ExtreMat)
Document Type: Poster
ID: 367422.0
Faserverstärktes Kupfer für Bauteile in Fusionsreaktoren
Authors: Brendel, A.; Paffenholz, V.; Köck, T.; Herrmann, A.
(Start) Date of Conference/Meeting
(YYYY-MM-DD):
 2008-02-27
Name of Conference/Meeting: 14. Nationales Symposium SAMPE Deutschland e.V. "Fasern und Matrix"
Place of Conference/Meeting: Technische Universität München, Garching
Document Type: Talk at Event
ID: 335631.0
Entries: 1-10  
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