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Comparison of the gas release at a hydrophobic and a hydrophilic direct bonding interface
Editors: Gösele, Ulrich; Baumgart, Helmut; Abe, Takano; Hunt, Charles; Iyer, S.
Authors: Mack, S.; Baumann, H.; Werner, H.; Schlögl, Robert
Title of Book: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
Start Page: 299
End Page: 306
Place of Publication: Pennington, NJ
Publisher: Electrochemical Society
Date of Publication (YYYY-MM-DD): 1998
Document Type: InBook
ID: 2021.0
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