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Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes
Authors: Gabriel, M.; Cetin, V.; Hansen, S.; Reiche, M.; Radu, I.; Eichler, M.
Place of Publication: Pennington, USA
Publisher: The Electrochemical Society
Date of Publication (YYYY-MM-DD): 2005
Title of Proceedings: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page: 50
End Page: 57
Title of Series: Proceedings volume / Electrochemical Society
Volume (in Series): 2005-02
Document Type: Conference-Paper
ID: 275360.0
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