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Damage evolution during cyclic tension-tension loading of micron-sized Cu lines
Authors: Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.
Date of Publication (YYYY-MM-DD): 2014
Title of Journal: Acta Materialia
Volume: 67
Start Page: 297
End Page: 307
Document Type: Article
ID: 673075.0
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