Gabriel, M., V. Cetin, S. Hansen, M. Reiche, I. Radu and M. Eichler: Capabilities of an ambient pressure plasma for activation in LT wafer bonding processes. In: Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications, (Eds.) K. D. Hobart, S. Bengtsson, H. Baumgart, T. Suga, C. E. Hunt. Proceedings volume / Electrochemical Society 2005-02. The Electrochemical Society, Pennington, USA (2005) 50-57.
The Max Planck Society does not take any responsibility for the content of this export.