Reiche, M., G. Gleixner and K. Kusel: Effect of peat quality on microbial greenhouse gas formation in an acidic fen. In: Biogeosciences 7, 187-198 (2010).
localid: BGC1317
Driussi, F., D. Esseni, L. Selmi, M. Schmidt, M. C. Lemme, H. Kurz, D. Buca, S. Mantl, M. Luysberg, R. Loo, D. Nguyen and M. Reiche: Fabrication, characterization and modeling of strained SOI MOSFETs with very large effective mobility.. In: Proceedings of the 37th European Solid-State Device Reseach Conference (ESSDERC 2007) (2007) 315-318.
Himcinschi, C., I. Radu, F. Muster, R. Singh, M. Reiche, M. Petzold, U. Gösele and S. H. Christiansen: Uniaxially strained silicon by wafer bonding and layer transfer.. In: Solid State Electronics 51, 2, 226-230 (2007).
Himcinschi, C., M. Reiche, R. Scholz, S. H. Christiansen and U. Gösele: Compressive uniaxially strained silicon on insulator by prestrained wafer bonding and layer transfer.. In: Applied Physics Letters 90, 23, Seq. No.: 231909 (2007).
Himcinschi, C., R. Singh, I. Radu, A. P. Milenin, W. Erfurth, M. Reiche, U. Gösele, S. H. Christiansen, F. Muster and M. Petzold: Strain relaxation in nanopatterned strained silicon round pillars.. In: Applied Physics Letters 90, 2, Seq. No.: 021902/1-3 (2007).
Kittler, M., T. Arguirov, X. Yu, G. Jia, O. F. Vyvenko, T. Mchedlidze, M. Reiche, J. Sha and D. Yang: Silicon nanostructures for IR light emitters.. In: Materials Science & Engineering C 27, 1252-1259 (2007).
Kittler, M., X. Yu, T. Mchedlidze, T. Arguirov, O. F. Vyvenko, W. Seifert, M. Reiche, T. Wilhelm, M. Seibt, O. Voß, A. Wolff and W. Fritzsche: Regular dislocation networks in silicon as a tool for nanostructure devices used in optics, biology, and electronics.. In: Small 3, 6, 964-973 (2007).
Ratzke, M., O. F. Vyvenko, X. Yu, J. Reif, M. Kittler and M. Reiche: Scanning probe studies of the electrical activity at interfaces formed by silicon wafer direct bonding. In: Physica Status Solidi C 4, 8, 2893-2897 (2007).
Reiche, M., C. Himcinschi, U. Gösele, S. H. Christiansen, S. Mantl, D. Buca, Q. T. Zhao, S. Feste, R. Loo, D. Nguyen, W. Buchholtz, A. Wei, M. Horstmann, D. Feijoo and P. Storck: Strained Silicon-On-Insulator - Fabrication and characterization. In: ECS Transactions 6, 4, 339-344 (2007).
Singh, R., I. Radu, M. Reiche, C. Himcinschi, B. Kuck, B. Tillack, U. Gösele and S. H. Christiansen: High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications. In: Applied Surface Science 253, 3595-3599 (2007).
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