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          Document History for Document ID 275262

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Document Version Version Comment Date Status
275262.0 [No comment] 16.10.2006 11:42 Released

ID: 275262.0, MPI für Mikrostrukturphysik / Publikationen 2005
Mechanisms of low-temperature wafer bonding
Authors:Reiche, M.; Radu, I.; Gabriel, M.; Zoberbier, M.; Hansen, S.; Eichler, M.
Publisher:The Electrochemical Society
Place of Publication:Pennington, USA
Date of Publication (YYYY-MM-DD):2005
Title of Proceedings:Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page:326
End Page:337
Volume (in Series):2005-02
Review Status:not specified
Audience:Not Specified
External Publication Status:published
Document Type:Conference-Paper
Communicated by:N. N.
Affiliations:MPI für Mikrostrukturphysik