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          Document History for Document ID 275267

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Document Version Version Comment Date Status
275267.0 [No comment] 16.10.2006 11:42 Released

ID: 275267.0, MPI für Mikrostrukturphysik / Publikationen 2005
Low-temperature wafer bonding via DBD surface activation
Authors:Radu, I.; Reiche, M.; Zoberbier, M.; Gabriel, M.; G”ösele, U.
Publisher:The Electrochemical Society
Place of Publication:Pennington, USA
Date of Publication (YYYY-MM-DD):2005
Title of Proceedings:Proceedings of the International Symposium Semiconductor Wafer Bonding VIII, Science and Technology, and Applications
Start Page:295
End Page:302
Title of Series:Proceedings volume / Electrochemical Society
Volume (in Series):2005-02
Review Status:not specified
Audience:Not Specified
External Publication Status:published
Document Type:Conference-Paper
Communicated by:N. N.
Affiliations:MPI für Mikrostrukturphysik