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          Document History for Document ID 352265

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Document Version Version Comment Date Status
352265.0 [No comment] 27.03.2008 21:31 Released

ID: 352265.0, MPI für Mikrostrukturphysik / Publikationen des MPI-MSP
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications
Authors:Singh, R.; Radu, I.; Reiche, M.; Himcinschi, C.; Kuck, B.; Tillack, B.; Gösele, U.; Christiansen, S. H.
Date of Publication (YYYY-MM-DD):2007
Title of Journal:Applied Surface Science
Volume:253
Start Page:3595
End Page:3599
Review Status:not specified
Audience:Not Specified
External Publication Status:published
Document Type:Article
Communicated by:N. N.
Affiliations:MPI für Mikrostrukturphysik