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          Document History for Document ID 572658

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Document Version Version Comment Date Status
572658.0 [No comment] 12.01.2012 08:22 Released

ID: 572658.0, MPI für Plasmaphysik / Articles, Books, Inbooks
Thermal and mechanical analysis of Wendelstein 7-X thermal shield
Authors:Nagel, M.; Freundt, S.; Posselt, H.
Language:English
Research Context:26th Symposium on Fusion Technology (SOFT 2010), Porto, 2010-09-27 to 2010-10-01
Date of Publication (YYYY-MM-DD):2011
Title of Journal:Fusion Engineering and Design
Volume:86
Issue / Number:9-11
Start Page:1830
End Page:1833
Copyright:Elsevier B.V.
Review Status:Peer-review
Audience:Experts Only
External Publication Status:published
Document Type:Article
Communicated by:N. N.
Affiliations:MPI für Plasmaphysik/W7-X Magnets and Cryostat (W7-X MC)
MPI für Plasmaphysik/W7-X System Engineering (W7-X SE)
External Affiliations:Linde AG Engineering Div., Dr.-Carl-von-Linde-Straße 6-14, D-82049 Hoellriegelskreuth, Germany
Identifiers:DOI:10.1016/j.fusengdes.2011.01.017
URL:http://dx.doi.org/10.1016/j.fusengdes.2011.01.017
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